Manufacturing Capabilities
PCB Manufacturing & Assembly Capabilities
PCB
PCBA
PCB
| Features | Capability | Notes |
|---|---|---|
| Layer count | 1-16 Layers | |
| Controlled Impedance | 1-16 Layers | |
| Material | FR-4 | FR-4 TG135 / TG150 / TG170 |
| Dielectric constant | 4.5 (Double-sided PCB) | 7628 Prepreg 3313 Prepreg 2116 Prepreg |
| Max. Dimension | 500x600mm | |
| Dimension Tolerance | +/- 0.13mm | |
| Board Thickness | Von 0.4 bis 3.2mm | The finished board thickness. |
| Thickness Tolerance ( Thickness≥1.0mm) | +/- 10% | |
| Thickness Tolerance ( Thickness<1.0mm) | +/- 0.1mm | |
| Finished Outer Layer Copper | 0.5oz/1oz/1.5oz/2oz/2.5oz/3oz/3.5oz/4oz/4.5oz/5oz | |
| Finished Inner Layer Copper | 0.5oz/1oz/1.5oz/2oz/2.5oz/3oz/3.5oz/4oz/4.5oz/5oz | |
| Drill/Hole Size | ||
| Drill Hole Size | 0.20mm- 6.30mm | |
| Drill Hole Size Tolerance | +/- 0.08mm | |
| Min. Via hole size | 0.2/0.3mm | For Single & Double Layer PCB, the min. via hole size is 0.3mm. For Multi Layer PCB, the min. via hole size is 0.2mm. |
| Min. Via diameter | 0.4mm | For Single & Double Layer PCB, the min. via diameter is 0.5mm. For Multi Layer PCB, the min. via diameter is 0.45mm (Limitation 0.4mm). |
| PTH hole Size | 0.20mm – 6.35mm | |
| Pad Size | Minimum 1.0mm | |
| Min. Non-plated holes | 0.50mm | |
| NPTH | 0.2mm | |
| Min. Plated Slots | 0.5mm | |
| Min. Non-Plated Slots | 1.0mm | |
| Hole size Tolerance (Plated) | +/- 0.08mm | |
| Hole size Tolerance (Non-Plated) | +/- 0.05mm | |
| Rectangle Hole/Slot | yes | |
| Minimum Annular Ring | ||
| Minimum annular ring 1oz Copper | 0.13mm | |
| Minimum annular ring 2oz Copper | 0.2mm | |
| PTH | 0.3mm | |
| Minimum clearance | ||
| Hole to hole clearance(Different nets) | 0.5mm | |
| Via to Via clearance(Same nets) | 0.254mm | |
| Pad to Pad clearance(Pad without hole, Different nets) | 0.127mm | |
| Pad to Pad clearance(Pad with hole, Different nets) | 0.5mm | |
| Via to Track | 0.254mm | |
| PTH to Track | 0.33mm | |
| NPTH to Track | 0.254mm | |
| Pad to Track | 0.2mm | |
| Minimum trace width and spacing | ||
| Min. Trace width 1-2 Layers | 0.127mm | |
| Min. Trace width 4-6 Layers | 0.09mm | |
| Min. Spacing 1-2 Layers | 0.127mm | |
| Min. Spacing 4-6 Layers | 0.09mm | |
| Min. Trace width 2oz Copper weight | 0.2mm | |
| Min. Spacing 2oz Copper weight | 0.2mm | |
| BGA | ||
| Min. BGA Pad Dimensions | 0.25 mm | |
| Min. Distance Between BGA | 0.127mm | |
| Solder Mask | ||
| Solder mask opening/ expansion | 0.05mm | |
| Solder mask bridge | 0.2mm (green) 0.254mm (other colors) | |
| Solder mask color | green, red, yellow, blue, white, black. matte green, matte blue, matte black. | |
| Solder mask dielectric constant | 3.8 | |
| Solder mask thickness | 10-15µm | |
| Silkscreen | ||
| Minimum Line Width | 0.153mm | |
| Minimum text height | 1.0mm | |
| Pad To Silkscreen | 0.15mm | |
| Board Outlines | ||
| Trace to Outline | 0.2mm | |
| Trace to V-cut line | 0.4mm | |
| Panelization | ||
| Panelization with space | 2mm | |
| Panelized Round board | ≥20mm x 20mm | |
| Min. Width of Breakaway Tab | 4mm | |
| Min. Edge Rails | 3mm | |
PCBA
| Features | PCBA |
|---|---|
| Assembly Types | Single & double sided placement (SMT/Thru-hole) |
| PCB Layer | 1 – 16 layers |
| Thickness | 0.4mm – 3.2mm |
| Dimension | 1mm Thickness: 350mm x 250mm 1.6mm Thickness 350mm x 300mm |
| Delivery Format | Single PCB, Panel with pips, Panel with V-cut |
| Minimum Package | 0201 |
| Minimum IC Pin Spacing | 0.3mm |
| Minimum BGA Spacing | 0.4mm |
| Reflow temperature | 255+/-5 °C |
| SPI | yes |
| AOI | yes |
| Visual Inspection | yes |
| X-ray Inspection | yes |
Special technology or deviating specification on request.